Thermal Behavior Measurement of Electronic Devices by Moire Interferometry under Thermal Cycle Test.
نویسندگان
چکیده
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ژورنال
عنوان ژورنال: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
سال: 2000
ISSN: 0387-5008,1884-8338
DOI: 10.1299/kikaia.66.2226